If your circuit is a rod mill and ball mill circuit, you will be much better off using a Bond analysis rather than SMC.
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I also see software that does these sorts of calculations using Bond or SMC/Mi equations ($3k to $5k per year subscription rates). I describe the technique in the short courses that I teach, but it is not something I can describe in an email.
To determine the energy for the individual components of the circuit is more difficult, and I use a method that Morrell dislikes to distribute energy between stages using a transfer size. That equation describes the total circuit energy. With the SMC and ball mill work index tests, Morrell claims you can determine the total specific energy from the primary crusher to the hydrocyclone overflow, and with minor changes described in his example you can use it for any type of grinding circuit. The equation is in two parts, and you need a Bond ball mill work index determination to complete the second part. If you look at the Appendix of your SMC test report, you will see a calculation example for determining the energy to grind from a feed size (F80) to a product size (P80).
There is another method using Bond-type testing that I normally prefer, but I do use SMC in my work. The SMC test is one way that you can "benchmark" an operating mill against a theoretical power consumption for a "typical" grinding circuit. I conferred with my friend at and he says the short answer is yes.
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